Rigid PCB capability_Teson Tech Corp.,Limited

Rigid PCB capability
Layer count	2~30 layers
Laminates type	FR-4,CEM-1,CEM-3,BT Resin, Teflon,PTFE, Rogers,Aluminium, Tg130℃(150℃,170 ℃,180 ℃ 210℃), Berquist, Thermagon,Alon.Polyclad
Board thickness	Min: 2-Layer: 0.2 mm -6.0 mm 4-Layer: 0.40mm -8.0mm 6-Layer: 0.8 mm -8.0 mm 8-Layer: 1.0 mm -8.0mm 10-Layer: 1.2 mm -8.0 mm 12-Layer: 1.5 mm -8.0mm Max: 8mm (0.3150")
Base copper thickness	Mass production: Min: 12um (1/3oz) Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer Sample: Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer
Min finished hole size	By mechanical drilling: 0.15mm (0.006") By laser drilling: 0.05mm (0.002")
Aspect ratio	12 : 1
Max panel size	Mass production, 540mm × 740m (21.25" × 29.13") Sample: 700mm × 1100mm (27.56" × 43.3")
Min line width/space	Mass production: 3mil/3mil Sample: Inner layer: 0.0635mm/0.0635mm (0.0025"/0.0025") Outer layer: 0.0585mm/0.0585mm (0.0023"/0.0023")
Via hole type	Blind/Burried/Plugged
HDI/Microvia	YES
Surface finish	HASL / Lead Free HASL Immersion Gold / Silver / Tin Flash Gold. Hard Gold plating Selective thick Gold Plating Gold Finger (Gold thickness up to 3um) Plating Silver (Silver through Hole, Carbon ink, Peelable mark, OSP
Solder mask	All kinds of colour LPI, Dry Film Min S/M pitch (LPI): 0.1mm
Impedance Control	Single trace or differential controlled 50, 60, 70, 100, 110, 120, 130 ±5%
Min bonding pitch	0.181mm (center to center)
Min SMT pitch	0.400mm (center to center)
Min annular ring	0.025mm
Outline finish type	CNC Routing; V-Scoring/Cut; Punch
Tolerances	Min Hole registration tolerance (NPTH) ± 0.025mm Min Hole registration tolerance (PTH) ± 0.075mm Min Pattern registration tolerance ± 0.05mm Min S/M registration tolerance (LPI) ± 0.075mm Scoring Lines ± 0.15mm Board thickness (0.1 -1.0mm ) ±15% Board thickness (1.0 -6.35mm ) ±10% Board Size Routed ± 0.1mm Board Size Scored ± 0.2mm
Electrical Testing	Voltage 10V - 250V Continuity 10 - 1000 Ohms